SEMI Forecasts Semiconductor Fab Equipment Spending Surge

SEMI projects worldwide 300mm fab equipment spending to increase significantly, reaching $151 billion in 2027 and $172 billion in 2029. This growth is primarily fueled by the escalating demand for AI chips in data centers and edge devices, alongside a global commitment to semiconductor self-sufficiency. The Logic & Micro segment is expected to lead investments with $228 billion from 2027-2029, driven by sub-2nm cutting-edge capacity. The memory segment, including DRAM and 3D NAND, is projected to see $175 billion in investments during the same period, boosted by AI training and inference demands for High Bandwidth Memory (HBM) and storage. Key regions like China, Taiwan, South Korea, and the Americas are anticipated to see substantial spending, supported by advanced-node expansion, memory capacity additions, and policy-backed supply chain localization. Japan, Europe & Middle East, and Southeast Asia are also expected to show meaningful growth.