Microchip launches 3.3 kV mSiC modules
Analysis based on 7 articles · First reported May 26, 2026 · Last updated May 28, 2026
The launch of Microchip Technology's new power modules is expected to positively impact the semiconductor industry by providing more efficient solutions for high-voltage power applications. This innovation could lead to increased adoption of solid-state transformers in AI data centers, potentially boosting Microchip Technology's market share and revenue.
Microchip Technology has announced the availability of its new 3.3 kV HV-D3 mSiC Power Modules. These modules are designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in Artificial intelligence hyperscale data centers and other high-voltage power applications. The modules integrate 3.3 kV silicon carbide (SiC) mSiC MOSFETs and Schottky diodes, enabling efficient power delivery from the medium-voltage grid directly to server racks. This development addresses the increasing power demands and efficiency requirements of scaling Artificial intelligence data centers, offering a foundational shift in power delivery by reducing conversion stages and enhancing system efficiency. Clayton Pillion, Vice President of Microchip Technology's high-power solutions business unit, highlighted the modules' ability to reduce the number of series-connected devices and bridge a gap in the industrial market for 100-300A products. The modules are also suitable for other applications such as megawatt charging infrastructure, rail/heavy transportation, medium-voltage motor drives, industrial, and defense power systems.
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