Odisha, Intel, 3DGS $3.3B Semiconductor MoU

The India — Odisha government, in collaboration with Intel and Patriot Glass Solutions (3DGS), has signed a Memorandum of Understanding (MoU) to establish an advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region of India — Odisha, India. This project, estimated at $3.3 billion, is a major step in India's semiconductor mission, aiming to strengthen domestic manufacturing and supply-chain resilience. The facility will focus on advanced packaging glass-core substrates and high-density interconnect substrates, creating over 1,800 direct high-skilled jobs. Union Electronics and IT Minister Ashwini Vaishnaw and India — Odisha Chief Minister Mohan Charan Majhi highlighted the initiative's importance for India's semiconductor ecosystem. This development builds on previous efforts, including the groundbreaking of India's first Advanced 3D Glass Semiconductor Packaging Unit by Heterogeneous Integration Packaging Solutions, a subsidiary of 3DGS, in India — Odisha. The project is supported by the India Semiconductor Mission and is expected to position India — Odisha as an emerging semiconductor and digital infrastructure hub.