India's First 3D Chip Packaging Unit in Odisha
Analysis based on 40 articles · First reported Apr 18, 2026 · Last updated Apr 20, 2026
The establishment of India's first advanced 3D chip packaging unit in India===Odisha signifies a major step towards self-reliance in high-end electronics, positively impacting the semiconductor and technology markets. This development is expected to attract further investments and reduce India's dependence on imports in critical technology sectors, boosting the overall market sentiment for domestic manufacturing.
The foundation stone for India's first advanced 3D chip packaging unit was laid in Info Valley, Bhubaneswar, India===Odisha, on April 19, 2026. This project, led by 3D Glass Solutions through its Indian arm Heterogeneous Integration Packaging Solutions, involves an investment of approximately ₹2,000 crore. The facility will utilize advanced 3D glass substrate technology for chip manufacturing, a next-generation innovation in the semiconductor sector. Union Minister for Electronics & IT Ashwini Vaishnaw and India===Odisha Chief Minister Mohan Charan Majhi highlighted the project's importance for strengthening India's domestic semiconductor ecosystem and advancing the Atmanirbhar Bharat vision. The unit is expected to produce 70,000 glass panels annually, along with 50 million assembled units and around 13,000 advanced 3DHI modules, creating 2,500 employment opportunities. India===Odisha is emerging as a key hub for semiconductor investments, hosting both a compound semiconductor fabrication unit and this 3D glass substrate packaging facility.
Set up alerts, explore entity relationships, search across thousands of events, and build custom intelligence feeds.
Open Dashboard