Snapshot from Apr 21, 2026 at 07:00 UTC. For live data and tracking: View Live
Entities / SiCSem Private Limited
Entity

SiCSem Private Limited

Tracked across 1 events · 37 articles · First seen Apr 18, 2026 · Last active Apr 20, 2026

Sentiment
60
Attention
4
Events
1
Relationships
1
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Events (1)
4 60
Tech
India's First 3D Chip Packaging Unit in Odisha
SiCSem Private Limited is establishing India's first commercial compound semiconductor fabrication unit in Info Valley, Bhubaneswar, in collaboration with Clas-SiC Wafer Fab Ltd. This project, alongside the 3DGS facility, underscores India===Odisha's growing role in India's domestic chip ecosystem.
Apr 18, 2026 · 37 articles
Key Actions (1)
70 SiCSem Private Limited established India's first commercial compound semiconductor fabrication unitIndia's First 3D Chip...
Relationships (1)
Clas-SiC Wafer Fab collaborator ↔ SiCSem Private Limited SiCSem Private Limited collaborates with Clas-SiC Wafer Fab for semiconductor fa
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